A leading semiconductor manufacturer faced a complex testing challenge: validating high-performance processing units and AI chips while managing a continuous 80 kW thermal load generated by active server chassis. Conventional environmental test chambers struggled to maintain temperature uniformity and humidity control under these extreme operating conditions. Weiss Technik engineered a custom front-to-back airflow chamber featuring high-velocity air distribution, a 110 HP refrigeration system, and atomizing humidity control, enabling accurate and repeatable environmental testing of high-density AI and semiconductor hardware under sustained high-heat loads.
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